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Chairholder Profile

Dominique Drouin

Dominique Drouin

Interdisciplinary Institute for Technological Innovation, Department of Electrical Engineering and Computer Engineering
Université de Sherbrooke

Chair Title

NSERC/IBM Canada Industrial Research Chair in Smarter Microelectronic Packaging for performance scaling

Chair Program

Industrial Research Chairs Program

Role

Senior Chairholder since 2014

Related Chairs

David Danovitch
Julien Sylvestre

Summary

This Triple Chair is focused on science and technology for advancing microelectronic packaging. The multi-disciplinary field is concerned with connecting and protecting the microchips that we use in our everyday lives to connect to the internet, conduct bank ATM transactions or play video games.

With microchip manufacturers finding it increasingly difficult to meet the exponential performance growth that the world has come to expect, packaging is being called upon to provide innovative, even revolutionary, solutions. Our Triple Chair program places particular emphasis on one such solution – the three-dimensional (3D) stacking of microchips, in which a “skyscraper” approach allows multiple chips to communicate to each other more rapidly using less energy and real estate. This technology is considered critical to the future electronic market that will be dominated by data-hungry applications such as video streaming and data analysis.

To help make 3D packaging a reality, we are planning research across a broad spectrum, ranging from innovative, industry-compatible processes to groundbreaking materials to make chip packages more flexible, yet stronger and more reliable. Our research will study how these new materials behave at the microscopic level necessary to process microchips, while remaining compatible with competitive, automated manufacturing operations. This research is made possible through the use of state-of-the-art equipment at the Interdisciplinary Institute for Technological Innovation (3IT) and MiQro Innovation Collaborative Center (C2MI) laboratory facilities that enable production-scale simulations.

Building upon the solid relationship between Université de Sherbrooke and IBM Canada in microelectronic packaging, the Triple Chair will create a critical mass that is unprecedented in Canada for advancing progress in materials and methods to interconnect chips to each other and the outside world. These efforts will result in a greater fundamental understanding of electrical, metallurgical and mechanical issues at play in advanced packaging processes (such as why electrical connections crack in new, ultra-miniaturized configurations). It will also generate innovative tools, techniques and manufacturing approaches tailored to the needs of high tech, such as high-speed, high-precision electrical connections or microscopically controlled material flow. The benefits of this program are broad in reach, ranging from improved performance (speed, miniaturization and energy efficiency) of electronic devices themselves to an overall enhancement of Canadian industrial capability and hence increased global competitiveness.

Contact Information

Interdisciplinary Institute for Technological Innovation, Department of Electrical Engineering and Computer Engineering
Université de Sherbrooke
3000 De l’Université Boulevard
Sherbrooke, Québec
J1K 0A5

Tel.: 819-821-8000, ext. 62115
Email: dominique.drouin@usherbrooke.ca

Website:
This link will take you to another Web site http://www.usherbrooke.ca/3it